SK Hynix has made a groundbreaking announcement regarding the status of their HBM memory production capacity. The company has confirmed that all production capacity for this year has been completely sold out, with bookings for next year nearly reaching full capacity. The surge in demand for AI products in data centers is cited as the primary driving force behind this development.
During a press conference in South Korea, SK Hynix CEO Kwak Noh-Jung elaborated on the current market dynamics, an event which was covered by TrendForce. The market share for HBM and high-capacity memory modules is projected to grow from 5 percent in 2023 to 61 percent by 2028. This type of memory is primarily utilized in AI accelerators manufactured by companies like Nvidia and AMD.
SK Hynix isn't the only player experiencing high demand for HBM products. Micron disclosed in late March that their HBM production capacity for 2025 is also nearly exhausted. According to data from TrendForce, SK Hynix maintains a significant lead in the HBM market, commanding a market share between 47 and 49 percent along with Samsung. Micron holds a third-place position with a market share ranging from 3 to 5 percent.
Looking ahead, SK Hynix has shared plans to provide samples of their cutting-edge HBM3e chips with twelve layers to partners this month, with mass production slated to commence in the third quarter. Additionally, the company is scheduled to begin mass production of HBM4 in the latter half of 2028 according to their current timeline.
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